The invention relates to a semiconductor packaging structure with a pin side wall tin climbing function, and a manufacturing process thereof. The semiconductor packaging structure comprises a base island and pins; the pin comprises a planar part and an arc-shaped part; the arc-shaped part is positioned on the outer side of the planar part; the convex surface of the arc-shaped part faces the outward lower side; a chip is arranged on the front surface of the base island; the chip is electrically connected with the pin through a metal bonding wire; the pins, the base island and the peripheral region of the chip are packaged with a plastic packaging material; and the outer surfaces of the planar part and the arc-shaped part are exposed from the plastic packaging material. The side edge tin-plating area of the pin can be enlarged effectively, and a condition that the residual air in the outer convex arc-shaped position of the pin cannot be discharged outwards can be avoided, thereby improving welding performance and welding reliability of the product.