The invention provides a power device module and a preparation method thereof. The power device module comprises a power chip, a first metal film and a second metal film, wherein the first metal filmand the second metal film are arranged on the upper surface and the lower surface of the power chip respectively. The problem that the heat dissipation of the power device is poor caused by the fact that the contact thermal resistance and contact resistance of an existing pressing type power device are relatively high is solved, and the initial failure phenomenon of the power device module is reduced.