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发明授权
CN108239258B 一种改性环氧树脂及其制备方法和LED灯珠封装材料 有权

一种改性环氧树脂及其制备方法和LED灯珠封装材料
摘要：
本发明涉及LED灯珠封装领域，公开了一种改性环氧树脂及其制备方法和LED灯珠封装材料，其特征在于，所述改性环氧树脂具有如式(1)所示的结构；其中，n为1‑10，R1为H或C1‑C5的直链或支链烷基，R2为H或R’为H或C1‑C6的直链或支链烷基。本发明通过将异氰尿酸三缩水甘油酯(TGIC)改性，形成大分子量的改性环氧树脂，所述改性环氧树脂具有较高的软化点和粘度。
摘要（英）：

The invention relates to the field of LED lamp bead encapsulation and discloses a modified epoxy resin and a preparation method thereof and an LED lamp bead encapsulating material. The modified epoxyresin is characterized in that the modified epoxy resin has a structure as shown in a formula (1), wherein n is 1-10, R1 is H or C1-C5 straight chain or branch chain alkyl, R2 is H or a formula as show in the description, and R' is H or C1-C6 straight chain or branch chain alkyl. By modifying triglycidyl isocyanurate (TGIC), modified epoxy resin with a high molecule weight is formed, and the modified epoxy resin has a relatively high softening point and high viscosity. The formula is as show in the specifications.

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