The invention discloses a DIP16 multichip packaging special lead frame machine packaging method. A lead frame body is included; the lead frame body is provided with multiple frame units; one side of the frame unit is provided with pins from a first to an eighth, and the other side is provided with pins from a ninth to a sixteenth; a long base island is also arranged on the frame unit; two sides ofthe long base island are provided with base islands from a first to a fourth; and chips are attached to the base islands from the first to the fourth. Through integrating multiple MOS transistors onthe same chip and realizing switching of positive and negative electric signals and switching of strong and weak electric signals through external lines, the area of an integrated circuit board can beeffectively reduced in the case of system integration, and miniaturization of the integrated circuit is thus realized.