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发明授权
CN108269899B 发光二极管封装结构及其制造方法 有权

发光二极管封装结构及其制造方法
摘要：
本发明公开一种荧光粉片供应模块、发光二极管封装结构及其制造方法，所述发光二极管封装结构包括基板、设置于基板且呈共平面的电极层与绝缘层、安装于电极层与绝缘层的发光二极管芯片、完整包覆于发光二极管芯片顶面的荧光粉片及设置于电极层与绝缘层上且包覆发光二极管芯片与荧光粉片侧缘的反射壳体。反射壳体的顶平面凹设形成有开孔，以裸露出荧光粉片的出光面，反射壳体的顶平面相对于基板的距离大于出光面相对于基板的距离，并且顶平面与出光面的距离为10微米至30微米。借此，本发明的发光二极管封装结构能够避免相邻发光二极管芯片和相邻荧光粉片产生互相干扰，并可有效地提升发光效率。
摘要（英）：

An LED package structure includes a substrate, an electrode layer and an insulating layer disposed on the substrate with a coplanar arrangement, an LED chip mounted on the electrode layer and the insulating layer, a phosphor plate covering a top surface of the LED chip, and a reflective housing disposed on the electrode layer and the insulating layer and covering side surfaces of the LED chip and side surfaces of the phosphor plate. An opening is formed on the top surface of the reflective housing so as to expose a light emitting surface of the phosphor plate. A distance between the top surface of the reflective housing and the substrate is greater than a distance between the light emitting surface of the phosphor plate and the substrate. A distance between the top surface of the reflective housing and the light emitting surface is in a range of 10˜30 μm.

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