The invention provides graphene-containing self-repairing epoxy conductive adhesive and belongs to the technical field of novel electronic materials. The self-repairing epoxy silver colloid is prepared from the following components in percentage by weight: 0 to 20 percent of graphene, 50 to 80 percent of conductive metal powder, 1 to 10 percent of epoxy resin, 1 to 5 percent of an epoxy diluent, 5to 15 percent of a dynamic curing agent, 0.1 to 1 percent of a curing accelerator, 0.1 to 1 percent of a self-repairing accelerator and 0.5 to 2 percent of a coupling agent. According to the graphene-containing self-repairing epoxy silver colloid, disclosed by the invention, self-repairing of a resin network in the conductive adhesive is realized by introducing the dynamic curing agent, so that the service life of the material is relatively long; the graphene and the conductive metal powder are added for mixed use, so that the conductivity and thermal conductivity of the conductive adhesive are greatly improved; the conductive adhesive with excellent comprehensive performance is prepared, and further can meet the application to the fields of high-power semiconductor packaging and light-emitting diodes.