The invention provides a method of preventing an electronic tag from being dismantled. A base plate is taken as a substrate of an electronic tag. The method of preventing an electronic tag from beingdismantled comprises the following steps: (a) multiple through holes are formed by punching around a chip on one side of a substrate, and the chip and an antenna are located on the same side of the substrate; (b) on the chip-containing side of the substrate, part of the substrate containing the chip and the antenna is coated with epoxy resin adhesive; (c) double-sided adhesive is pasted on the other side of the substrate; (d) a hole is formed in a position, corresponding to the chip, of the double-sided adhesive; and (e) when an electronic tag is installed, liquid adhesive is injected into thehole of the double-sided adhesive, and the electronic tag is glued onto an object by the double-sided adhesive and the liquid adhesive together.