The invention discloses a computer chip water cooling heat dissipation structure. The computer chip water cooling heat dissipation structure comprises a base; a mounting groove is formed in the top side of the base; a chip is fixedly mounted in the mounting groove; a hollow cavity, which is positioned in one side of the mounting groove, is formed in the base; a heat conducting hole is formed in the inner wall of one side, closes to the mounting groove, of the hollow cavity; the heat conducting hole is connected with the mounting groove; a heat conducting block is fixedly mounted in the heat conducting hole; the two sides of the heat conducting block both extend to the outside of the heat conducting hole; a fixed pipe is fixedly mounted on the inner wall of one side, closes to the mountinggroove, of the hollow cavity; the part, which extends to the hollow cavity, of the heat conducting block is positioned in the fixed pipe; one side, far from the chip, of the fixed pipe is sleeved witha balloon in a sealing manner; a sliding plate is glidingly mounted in the hollow cavity; one side, close to the chip, of the sliding plate is in contact with the balloon; and a first conductive block is fixedly mounted on the other side of the sliding plate. The computer chip water cooling heat dissipation structure can perform water cooling on the chip and has a high cooling effect; when the chip temperature is overhigh, an alarm performs alarming to remind; and the computer chip water cooling heat dissipation structure is simple in structure, convenient to operate and high in safety.