A base panel suitable to be processed into a covering panel, consisting of the following layers: (i) a substrate having a top surface, (ii) a resilient layer having a top surface and a bottom surface, whereby the bottom surface is connected to the top surface of said substrate, and (iii) optionally, a contact layer between the bottom surface of said resilient layer and the top surface of said substrate. A covering panel further comprising a digitally printed decor on the top surface of the resilient layer of the base panel, and a process of producing covering panels from said base panels.