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发明公开
CN108368239A 环氧树脂组成物、环氧树脂组成物成型体、硬化物及半导体装置 审中-实审

环氧树脂组成物、环氧树脂组成物成型体、硬化物及半导体装置
摘要：
提供一种硬化物的耐热性、吸水特性、电气可靠性及难燃性优异的环氧树脂组成物、其成型体、所述的硬化物、以及该硬化物构成的半导体装置。环氧树脂组成物含有双官能以上的环氧树脂(A)、具有伸联苯酚醛清漆结构的苯胺树脂(B)及含有选自硅胶及氧化铝中的至少一者的无机填料(C)，该无机填料的含量为上述A～C的3种成分的总量的50～95重量％。
摘要（英）：

Provided are an epoxy resin composition, cured articles of which have excellent heat resistance, water absorbing characteristics, electrical reliability, and flame retardancy; a compact thereof; a cured article thereof; and a semiconductor device composed of the cured article. The epoxy resin composition contains (A) a bifunctional or higher functional epoxy resin, (B) an aniline resin having a biphenylene novolac structure, and (C) an organic filler containing at least one material selected from silica gel and alumina, the content of the organic filler being equivalent to 50-95 wt% of the total amount of the three components A to C.

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