The invention discloses a vacuum film plating equipment. The vacuum film plating equipment comprises a vacuum chamber, a winding system, two arc ion target assemblies, and two magnetron sputtering target assemblies; one end of the vacuum chamber is provided with an arc ion film plating zone, and the other end is provided with a magnetron sputtering film plating zone; the arc ion film plating zoneis communicated with the magnetron sputtering film plating zone; the winding system comprises a front side arc ion film plating roller, a reverse side arc ion film plating roller, a reverse side magnetron sputtering film plating roller, and a front side magnetron sputtering film plating roller; a part to be plated is delivered through the front side arc ion film plating roller, the reverse side arc ion film plating roller, the reverse side magnetron sputtering film plating roller, and the front side magnetron sputtering film plating roller successively; one arc ion target assembly is arrangednext to the front side arc ion film plating roller toward the front side of the part to be plated, and the other arc ion target assembly is arranged next to the reverse side arc ion film plating roller toward the reverse side of the part to be plated; one of the magnetron sputtering target assembly is arranged next to the front side magnetron sputtering film plating roller toward the front side ofthe part to be plated, and the other magnetron sputtering target assembly is arranged next to the reverse side magnetron sputtering film plating roller toward the reverse side of the part to be plated. The efficiency is higher, and the vacuum film plating equipment is used in the field of film plating.