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发明公开
CN108417690A 一种发光二极管 有权

一种发光二极管
摘要：
本发明公开一种发光二极管。所述发光二极管包括：玻璃盖板、陶瓷基板、发光二极管芯片和电路结构层；其中，所述陶瓷基板开设有凹槽，所述玻璃盖板的形状与所述凹槽的形状匹配，且所述玻璃盖板盖设在所述凹槽上；在所述陶瓷基板的与所述玻璃盖板接触的表面处设置有釉料层；在所述玻璃盖板的与所述凹槽接触的表面处设置有玻璃浆料层，所述玻璃浆料层用于将所述玻璃盖板与所述陶瓷基板熔接在一起；所述发光二极管芯片设置在所述凹槽内，且所述发光二极管芯片与所述电路结构层连接。本发明提供的发光二极管，在陶瓷基板表面制作平滑的釉料层，使用玻璃浆料来实现玻璃盖板与陶瓷基板的低温紧密熔接，降低了工艺复杂性的同时又提高了发光二极管的封装气密性和可靠性。
摘要（英）：

The invention discloses a light-emitting diode. The light-emitting diode comprises a glass cover plate, a ceramic substrate, a light-emitting diode chip and a circuit structure layer. The ceramic substrate is provided with a groove. The shape of the glass cover plate is matched with the shape of the groove, and the glass cover plate covers the groove. The contact surface of the ceramic substrate and the glass cover plate is provided with a glaze layer. The contact surface of the glass cover plate and the groove is provided with a glass paste layer. The glass paste layer is used for welding theglass cover plate and the ceramic substrate together in a fusion way. The light-emitting diode chip is arranged in the groove, and the light-emitting diode chip is connected with the circuit structure layer. According to the light-emitting diode, the smooth glaze layer is manufactured on the surface of the ceramic substrate, and low temperature compact fusion welding of the glass cover plate andthe ceramic substrate is realized by using the glass paste so that the process complexity can be reduced, and the packaging air tightness and the reliability of the light-emitting diode can be enhanced.

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