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发明授权
CN108447849B 半导体封装 有权

半导体封装
摘要：
本发明之一半导体封装包括：一钝化层(passivation layer)，其具有一第一表面及与该第一表面相对之一第二表面该钝化层界定自该第一表面延伸至该第二表面之一通孔(through hole)，其自该第一面延伸至该第二表面，该通孔进一步由该钝化层之一第一侧壁及一第二侧壁所界定；一第一传导层，其在该钝化层之该第一表面及该第一侧壁上；一第二传导层，其在该钝化层之该第二表面及该第二侧壁上；及一第三传导层，其系介于该第一传导层与该第二传导层之间。
摘要（英）：

A semiconductor package includes: a passivation layer having a first surface and a second surface opposite to the first surface, the passivation layer defining a through hole extending from the first surface to the second surface, the through hole being further defined by a first sidewall and a second sidewall of the passivation layer; a first conductive layer on the first surface of the passivation layer and the first sidewall; a second conductive layer on the second surface of the passivation layer and the second sidewall; and a third conductive layer between the first conductive layer and the second conductive layer.

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