An adhesive composition is provided that includes a block copolymer present at greater than or equal to 30 total weight percent of the adhesive system comprising a high glass transition temperature in subunits Y and Y′, each of the subunits Y and Y′ having a high glass transition temperature of from 70° C. to 130° C. with a low glass transition temperature subunit Z having a low glass transition temperature of from −100° C. to 10° C. intermediate between said high glass transition temperature acrylate subunits to define a structure Y-Z-Y′. The triblock copolymer is dissolved in a monomer curable under free radical. A free radical initiator of a peroxide or a hydroperoxide are present in combination with a sulfonyl chloride, dihydropyridine and copper or vanadium salt. By heating the cured adhesive at or above 70° C., the adhesive is amenable to being removed, repaired, or reworked.