The invention discloses a thermal interface material and a preparation method and application method thereof. The preparation method of the thermal interface material comprises the following steps of(S1) selecting a metal foam material as a substrate; (S2) carrying out surface cleaning treatment on the substrate; and (S3) loading low-melting-point metals and/or alloys on the upper surface and thelower surface of the substrate obtained in the step (S2) and preparing the metal foam material with a sandwich structure as the thermal interface material. The prepared thermal interface material hasrelatively high thermal conductivity and is applicable to heat dissipation of a semiconductor power device.