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发明授权
CN108516810B 一种高导热瓷砖及制作方法 有权

一种高导热瓷砖及制作方法
摘要：
本发明公开了一种高导热瓷砖，该高导热瓷砖的化学成分为：氧化硅61～63％、氧化铝29～31％、氧化铁1～1.5％、氧化钛0.85～0.9％、氧化钙0.27～0.31％、氧化镁1.1～1.15％、氧化钾2.1～2.35％、氧化钠1.75～2％、氧化锂0.4～0.6％；高导热瓷砖的导热系数为2.5～3.5W/m·K。相应的，本发明还公开了一种的高导热瓷砖的制备方法，包括：将高导热瓷砖的坯体原料按比例混合均匀，压制成为坯体；将坯体入辊道窑烧制；获得成品。本发明的高导热瓷砖具有较高的高热性能，烧制工艺易控，烧制成本低。
摘要（英）：

The invention discloses a high thermal conductivity tile. The chemical components of the high thermal conductivity tile are 61-63% of silicon dioxide, 29-31% of aluminium dioxide, 1-1.5% of ferric oxide, 0.85-0.9% of titanium dioxide, 0.27-0.31% of calcium oxide, 1.1-1.15% of magnesium oxide, 2.1-2.35% of potassium oxide, 1.75-2% of sodium oxide and 0.4-0.6% of lithium oxide; the heat conductivitycoefficient of the high thermal conductivity tile is 2.5-3.5 W/m.K. Correspondingly, the invention further discloses a preparation method of the high thermal conductivity tile. The method comprises the steps that green body raw materials of the high thermal conductivity tile are evenly mixed in proportion, and through pressing, a green body is formed; the green body is put into a roller kiln forfiring; a finished product is obtained. The high thermal conductivity tile has higher high-heat performance, the firing technology is easy to control, and the firing cost is low.

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