The invention discloses a chip semiconductor ultrathin packaging device, which comprises a support seat fixedly arranged at the left upper end of a clamping seat and a main frame body arranged on theright end surface of the support seat in a matched mode through a landing gear; the bottom end surface of the clamping seat is fixedly provided with a base; the bottom end surface of the base is fixedly provided with a rubber base pad; the top end surface of the clamping seat is internally provided with a clamping cavity; the left inner wall and the right inner wall of the clamping cavity are internally symmetrically provided with first sliding cavities; the bottom wall in the sliding cavity is provided with a first turning cavity in an intercommunicated mode; a sliding plate is arranged in the first sliding cavity in a sliding mode; the extending tail end at the inner side of the sliding plate is inserted in the clamping cavity and the tail end is fixedly provided with a clamping plate arranged in the clamping cavity in a sliding matched mode; the bottom end surface of the sliding plate is provided with a first toothed strip; the first turning cavity is provided with a driving devicein power matched connection with the first toothed strip; and the bottom end surface of the main frame body is internally provided with an embedding cavity.