The invention provides an offset monitoring method of an interlamination of a circuit board. The method comprises the steps of setting a detection sampling area on the circuit board and setting a detecting module on the detection sampling area. The offset can be conveniently and quickly detected through an open-short test method, and the central layer on which the offset happens can be judged; moreover, the offset monitoring values of different testing modules assist to judge the scope of the offset distance; and the abnormity of the production process of the circuit board is convenient to analyze.