The invention relates to the field of a printed circuit, and discloses a circuit printing method. The method comprises the following steps of S1, printing a circuit diagram and cutting the printed circuit diagram to a template with a corresponding circuit shape, and piling the template on the substrate; S2, forming a mask coating on the substrate which is covered by a template obtained in the stepS1, and then removing the template; S3, forming a copper coating on the substrate and the mask coating formed in the step S2; and S4, washing the mask coating formed in the step S2 and the copper coating formed on the mask coating in the step S3. Before the mask coating is applied, the pre-designed circuit is printed for forming the template. The template covers the position which requires covering by the copper coating on the substrate, thereby realizing quick application of the mask coating on the position which does not require the copper coating on the substrate, realizing simple operation, improving manufacturing efficiency of the mask coating, and further improving manufacture efficiency of the printed circuit. The template preferably can cling to the template for attraction.