A heat dissipation device using a heat pipe panel includes inner panels (3) that have at least one connected heat pipe (2) connected in the circumferential direction. Apparatuses (1) are installed outside the inner panels (3), which are obtained by connecting, in the circumferential direction, a plurality of heat pipe panels (6) that have the heat pipes (2) therein, so that the heat produced in the apparatuses (1) is diffused in the circumferential direction of the inner panels (3). Furthermore, web panels (8) that have horizontally arranged heat pipes (11) therein and that have heat-dissipating surfaces (9) are radially arranged at the corners of the inner panels (3), and outer panels (4) that oppose the inner panels (3) also have heat pipes (13) therein in a horizontal manner and have heat-dissipating surfaces (5) disposed thereon, thus thermally connecting the heat pipes (2, 11, 13).