The present invention discloses sealed devices comprising a first substrate, a second substrate, an inorganic film between the first and second substrates, and at least one bond between the first andsecond substrates. The inorganic film can comprise about 10-80 mol% B2O3, about 5-60 mol% Bi2O3, and about 0-70 mol% ZnO. Methods for sealing devices using such an inorganic film are also disclosed herein, as well as display and electronic components comprising such sealed devices.