The embodiment of the invention provides an encapsulation method and an apparatus for a micron-level glass etching model. The encapsulation method comprises the following steps: an adhesive layer is formed on the encapsulation glass sheet by a preset spin coating method, and the thickness value at the thickest part of the adhesive layer is smaller than the width value at the narrowest part of thepore channel in the micron-level glass etching model; and the micron-scale glass etching model overlaid on the adhesive layer so that a surface of a channel of the micron-scale glass etching model isbonded with the encapsulation glass sheet. The invention can realize the encapsulation of the micron-level glass etching model, and the encapsulation process is convenient, reliable and high in efficiency.