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发明公开
CN109135612A 一种低熔点金属微纳米粉末导电胶及其制备方法 有权 转让

一种低熔点金属微纳米粉末导电胶及其制备方法
摘要：
本发明提出一种低熔点金属微纳米粉末导电胶，按质量比包括导电填料50％‑90％和基体树脂10％‑50％；其中，所述导电填料按质量比包括如下组分：低熔点金属微纳米粉末50％‑90％，银粉10‑50％。本发明还提出所述低熔点金属微纳米粉末导电胶的制备和应用。与Pd‑Sn合金、无铅焊料相比，本导电胶具有环境友好、低温键合、附着力好、细线印刷能力强、可用于柔性电路连接；与目前市场上的导电银胶、铜胶相比，本导电胶具有导热性能好、体积电阻率小、粘接强度高、工艺简单等优点，同时其制备方法简单、易于操作，成本远低于导电银胶。
摘要（英）：

The invention provides a low-melting-point metal micro-nano powder conductive adhesive. The adhesive comprises, by mass, 50-90% of conductive filler and 10-50% of matrix resin, wherein the conductivefiller comprises, by mass, 50-90% of low-melting-point metal micro-nano powder and 10-50% of silver powder. The invention further provides preparation and application of the low-melting-point metal micro-nano powder conductive adhesive. Compared with Pd-Sn alloy and lead-free solder, the conductive adhesive has the advantages of being environmentally friendly, good in low-temperature bonding and adhesive force, high in fine line printing capacity and capable of being used for being connected with a flexible circuit. Compared with conductive silver adhesives and copper adhesives in the currentmarket, the conductive adhesive has the advantages of being good in heat conduction performance, small in volume resistivity, high in bonding strength, simple in process and the like; meanwhile, a preparation method is simple and easy to operate, and the cost is much lower than that of the conductive silver adhesives.

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