The invention relates to a rapid plasma film coating method and a rapid plasma film coating apparatus. According to the present invention, an electric-conductive coil is arranged on the outer portionof a vacuum chamber, and the energy of a vacuum electric arc is centralized on an anode by using the longitudinal magnetic field generated by the electric-conductive coil to evaporate the material ofthe anode so as to ensure the rapid film plating of a film plating object; and with the method and the apparatus, the influence of the large microparticles generated by the cathode on the film qualitycan be avoided, and the energy of the electric arc can be controlled to be injected into the anode in a centralized manner under the action of the longitudinal magnetic field generated by the electric-conductive coil to accelerate the melting of the anode contact, such that the film can be rapidly formed on the film plating object.