The invention relates to an evaporation plating device and an evaporation plating method. The evaporation plating device comprises a container, an evaporation plating table, an evaporation plating material receptacle and extraction devices. The container is provided with an accommodating cavity. Holes are formed in the wall of the container. The evaporation plating table is arranged in the accommodating cavity. The evaporation plating material receptacle is provided with an accommodating space to accommodating evaporation plating materials. The accommodating space communicates with the accommodating cavity. The evaporation plating material receptacle is used for heating the evaporation plating materials to gasify the evaporation plating materials, and therefore the gas state evaporation plating materials can enter the accommodating cavity and are deposited on the evaporation plating table. Inlets of the extraction devices communicate with the accommodating cavity through the holes. Outlets of the extraction devices communicate with the accommodating space. The extraction devices are used for extracting the evaporation plating materials which are not deposited in the accommodating cavity and conveying the evaporation plating materials to the accommodating space. According to the evaporation plating device, the reduction degree of the evaporation plating rate of the evaporation plating materials due to the decrease of the evaporation plating materials can be reduced.