The invention relates to an electronic chip multi-station automatic suction processing production line. The production line comprises a supporting bottom plate, a conveyor belt and a suction device, wherein the conveyor belt is installed on the top of the left end of the supporting bottom plate, and the suction device is installed on the top of the outer end of the supporting bottom plate; the suction device comprises a suction supporting column, a suction top plate, a lead screw motor, a lead screw, a lead screw connecting plate, a moving block, a transposition mechanism and a suction mechanism; the transposition mechanism comprises a sliding column, a transposition top plate, a transposition motor, a transposition disc, a transposition sliding groove, a transposition sliding column, a clamping position telescopic rod, a clamping position spring and a clamping position clamping block. According to the production line, the problems that the conveying efficiency of IC chips is low whenexisting IC chips are packaged, the polarity of the IC chips cannot be corrected automatically, and the suction position of the IC chips is deviated are solved.