The invention discloses a method for printing a compound pocket through an offset lithography machine. The method includes the steps of combining paper, a lead film and a PE plastic film which are sequentially overlapped to form a roll-shaped three-layer compound packaging structure, conducting cutting to form a single piece of three-layer compound packaging paper, conducting printing and foldingin two, sending the paper into an ultrasonic welding machine, hot-pressing set positions of the three-layer compound packaging paper through a roller to complete the melting and sealing of two lateralsides of a compound pocket at all the positions in the single piece of three-layer compound packaging paper, and finally conducting die cutting to form a single compound pocket with a top opening. After an improvement, printing can be conveniently, rapidly and accurately conducted on the single piece of three-layer compound packaging paper; due to the hot-pressing of the roller, the friction damage can be effectively reduced, the hot-pressing work efficiency and pressing speed are increased, the uniformity and stability are remarkably improved, and the structural functions and effect of an existing offset press, an existing compound machine and the ultrasonic welding machine are sufficiently realized in this way; meanwhile, the operation requirements of a compound pocket processing assembly line are met, cost is low, and the quality is high.