A substrate carrier, a sputtering device, and a sputtering method. The substrate carrier comprises a frame-shaped body (10), an inner side face of the body (10) is provided with a plurality of through grooves (12), two ends of each through groove (12) are respectively connected to a first end face (13) and a second end face (14) of the body (10), each through groove (12) comprises a first zone (121) and a second zone (122) provided in the arrangement direction of the first end face (13) and the second end face (14) in sequence, and the groove depth of each through groove (12) in the first zone (121) is greater than that in the second zone (122). During sputtering, a substrate (1) covers an opening defined by the inner side face of the body (10) and overlaps the plurality of through grooves (12), the distance between the edge of the substrate (1) and the inner side face of the body (10) is a preset distance, and the preset distance is larger than the groove depth of the through groove (12) in the second zone (122) and smaller than the groove depth of the through groove (12) in the first zone (121). The area of an overlapped region between the substrate (1) and the substrate carrier can be reduced, and the effective film forming area of the substrate (1) in a sputtering manufacturing process is enlarged.