The invention discloses a sealing method of an integrated circuit sealing structure with a gold-tin alloy solder ring, and belongs to the technical field of integrated circuit electronic packaging. The sealing method includes the following steps: (1) obtaining the size of a sealing area of a tube shell; (2) designing the size of a cover plate and the solder ring according to a proportional relationship; (3) placing the designed cover plate on the tube shell and spot-welding and fixing the cover plate to form an assembly; and (4) fixing the assembly by using a pressure source and placing the assembly into a low-temperature sintering furnace for sintering to form the sealing structure. The method ensures that a gold-tin alloy sealing cavity meets requirements by designing the ratio of the size of the solder ring to the size of the sealing area.