Provided are a photosensitive resin composition, a cured film produced by curing the photosensitive resin composition, and an electronic device comprising the cured film, the photosensitive resin composition comprising (A) a polysiloxane polymer and (B) a solvent, wherein the (A) polysiloxane polymer is formed by subjecting at least one type of a silane compound, represented by chemical formula 1below, to hydrolysis and a condensation reaction, wherein a prebaked film is insoluble in an aqueous 2.38 wt% tetramethylammonium hydroxide (TMAH) solution and has a dissolution rate of 100 angstroms/sec or lower in an aqueous 5 wt% TMAH solution: [chemical formula 1] (R<1>)[a]SiX<1>[4-a], wherein R<1>, X<1> and a are as defined in the specification.