The invention discloses a crimp-type power semiconductor device internal pressure distribution measurement system. The system comprises a collector, an emitter and sub-modules; the collector, the sub-modules and the emitter are in contact connection with one another sequentially; the sub-modules are arranged between the collector and the emitter; each sub-module comprises a semiconductor chip, a heat flow and current conducting structure and a pressure sensor; the collector, the semiconductor chip, the heat flow and current conducting structure and the emitter are in contact connection with one another sequentially; and the pressure sensor is in contact connection with the bottom surface and end surface of the inner wall of the corresponding heat flow and current conducting structure. Withthe crimp-type power semiconductor device internal pressure distribution measurement system provided by the invention adopted, requirements for the pressure sensor can be lowered, and chip pressure distribution conditions under any working conditions can be realized; and the limitations of measurement under the normal working condition of an existing measuring method can be broken.