Belonging to the field of film preparation, the invention specifically discloses a polyamide resin composition for film production. The polyamide resin composition comprises polyamide resin, fatty acid bisamide with a chemical formula shown as formula 1, substituted fatty acid amide with a chemical formula shown as formula 2 and fatty acid amide with a chemical formula shown as formula 3. The invention jumps out of the technical constraint that the existing technology needs adding of inorganic particles to solve the film adhesion problem, provides a brand new solution idea, i.e. the fatty acidbisamide, substituted fatty acid amide and fatty acid amide collaborate and are used as adding components to improve the performance of polyamide, thus achieving acquisition of films with good performance, especially good adhesion resistance without adding inorganic particles.