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发明公开
CN110047765A 一种银纳米焊膏低温无压烧结方法 有权

一种银纳米焊膏低温无压烧结方法
摘要：
本发明公开了一种银纳米焊膏低温无压烧结方法，上述方法按照以下步骤实现银纳米焊膏的低温无压烧结：用等离子体设备对银纳米焊膏进行氧等离子体表面活化→采用甲醛蒸汽处理装置对表面活化过的银纳米焊膏进行处理→将芯片放于银纳米焊膏之上→低温无压烧结。本发明在烧结前利用氧等离子体表面活化和甲醛蒸汽处理的两步预处理方法去除银纳米焊膏中的多余有机物，相比于不处理的焊膏可以实现低温无压烧结，能够防止芯片受损。
摘要（英）：

The invention discloses a low-temperature pressureless sintering method for silver nano soldering paste. The low-temperature pressureless sintering of the silver nano soldering paste is realized according to the following steps: carrying out oxygen plasma surface activation on the silver nano soldering paste by using plasma equipment, processing the silver nano soldering paste subjected to surfaceactivation by using a formaldehyde steam treatment device, and putting a chip on the silver nano soldering paste for low-temperature pressureless sintering. According to the method, redundant organicmatters in the silver nano soldering paste are removed by utilizing a two-step pretreatment method of oxygen plasma surface activation and formaldehyde steam treatment before sintering, and comparedwith untreated soldering paste, low-temperature pressureless sintering can be realized, so that the chip can be prevented from being damaged.

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