The invention relates to a method for packaging and embedding a micro crystal temperature sensor. In the method, an outer groove (2) and an inner groove (3) are processed on the surface (6) of a measured object on which a sensor (1) is required to be placed along the direction of the surface (6) of the measured object or the direction vertical to the surface (6) of the measured object, wherein thecaliber of the outer groove (2) is larger than that of the inner groove (3), the sensor (1) is pasted on a substrate (4), then the substrate (4) is placed on a step surface (5) at the joint of the outer groove (2) and the inner groove (3), the sensor (1) is positioned in the inner groove (3) and is not contacted with the inner wall of the inner groove (3), and the outer groove (2) and the inner groove (3) are filled with the adhesive and are flat with the surface (6) of the measured object. The method realizes reliable bonding and fixing of the sensor on the surface of a high-speed aircraft,avoids the problem that the sensor falls in the temperature measurement process, and is beneficial to peeling of the sensor, thereby further improving the applicability of the sensor and the success rate of temperature measurement.