The invention relates to a novel copper cooling plate. The novel copper cooling plate is characterized by comprising a copper cooling plate body and cover plates, wherein at least one water passing groove is formed in the copper cooling plate body, groove openings of the water passing grooves are formed in the side wall of the copper cooling plate body, the cover plates are arranged on the grooveopenings of the water passing grooves and are used for sealing the groove openings of the water passing grooves, the cover plates are welded with the side wall of the copper cooling plate body, the inner walls of the water passing grooves and the cover plates jointly define a cooling channel, the cooling channel is composed of a plurality of channel sections, the channel section closest to the hotsurface of the copper cooling plate body is a hot surface channel section, and a turbulent flow structure is arranged in the hot surface channel section. The invention further provides a manufacturing method of the novel copper cooling plate. According to the novel copper cooling plate, a turbulent flow structure is additionally arranged inside the hot surface channel section, the boundary layerof the cooling fluid can be reduced, the heat exchange performance of the whole cooling channel is improved, the cooling strength of the copper cooling plate is improved, and the service life of the copper cooling plate is prolonged.