The invention provides a process for manufacturing a light-emitting semiconductor of a glass fluorescent sheet. The process comprises a die bonding step, a glass fluorescent sheet manufacturing step and a chip attaching step. The die bonding step and the glass fluorescent sheet manufacturing step have no the sequence front and back; the die bonding step comprises: performing die bonding operationfor chips on a substrate, performing baking after the die bonding to cure the die bonding glue, and performing wire bonding after baking, and the chip attaching step comprises: performing attaching ofcorresponding glass fluorescent sheets on a die bonder, wherein namely, one glass fluorescent sheet corresponds to one chip, and when the glass fluorescent sheets are attached to the chips, silica gel or silicon resin is employed for the connection between the glass fluorescent sheets and the chips, performing baking and curing after attaching, and completing the attaching of the chips after curing. The process for manufacturing a light-emitting semiconductor of a glass fluorescent sheet can improve the utilization of the fluorescent powder, and is better in color temperature consistency, operability, heat resistance and antidumping.