The invention discloses a cutting process of a high-precision double-corner quartz crystal wafer, and belongs to the technical field of quartz crystal cutting. According to the process, a wire cuttingmachine is used for cutting bonded quartz crystal rods; in the cutting process, the diameter of a cutting steel wire is 0.10 mm-0.15 mm; the grain size of grinding sand is 8 microns-15 microns; the sand-liquid ratio is 1:1 to 1:1.4, and the stirring time is 2.5 hours to 3.5 hours; the linear speed of the steel wire is 250 m/min to 270 m/min; the feeding speed of a working table is 0.14 mm/min to0.18 mm/min; and the wire supply speed is 5 m/min to 10 m/min. The process has the characteristics of being simple in operation, high in efficiency, high in sheet yield, high in cutting angle precision, small in angular dispersion, low in surface damage degree of the quartz crystal wafer and the like, and a solid foundation is laid for mass production of high-precision quartz oscillators.