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发明公开
CN110429170A 一种用紫外光固化的芯片器件封装工艺 有权

  • 专利标题： 一种用紫外光固化的芯片器件封装工艺
  • 专利标题（英）： Chip device packaging process using ultraviolet curing
  • 申请号： CN201910542874.2
    申请日： 2019-06-21
  • 公开(公告)号： CN110429170A
    公开(公告)日： 2019-11-08
  • 发明人: 王钢 , 严兵 , 陈梓敏
  • 申请人： 中山大学
  • 申请人地址： 广东省广州市番禺区大学城外环东路132号中山大学纳米楼
  • 专利权人： 中山大学
  • 当前专利权人： 中山大学
  • 当前专利权人地址： 广东省广州市番禺区大学城外环东路132号中山大学纳米楼
  • 代理机构： 广州圣理华知识产权代理有限公司
  • 代理商 胡小英
  • 主分类号： H01L33/52
  • IPC分类号： H01L33/52 ;  H01L33/56
一种用紫外光固化的芯片器件封装工艺
摘要：
本发明提供了一种用紫外光固化的芯片器件封装工艺，包括如下步骤：S1.将紫外固化胶在室温下搅拌混合均匀后进行抽真空除气泡，形成均匀稳定的紫外固化胶；S2.将紫外固化胶均匀涂敷在封装基板和芯片表面，紫外固化胶对芯片形成包覆结构且与封装基板和芯片接触良好；S3.将所需波长的近紫外光均匀的照射在紫外固化胶表面，待紫外固化胶反应完全固化后移除近紫外光，完成紫外光固化封装工艺。本发明采用MTQ硅树脂、含有巯基的MTQ硅树脂、含有苯基的MTQ硅树脂和光引发剂制备紫外固化胶，极大地提高了紫外固化胶对芯片封装的密封性以及透明稳定性。本发明所述封装工艺成本低廉且高效快速，具有显著的经济效益。
摘要（英）：

The invention provides a chip device packaging process using ultraviolet curing, comprising the following steps of S1, uniformly stirring and mixing an ultraviolet curing adhesive at room temperature,and then vacuumizing the ultraviolet curing adhesive to remove bubbles so as to form a uniform and stable ultraviolet curing adhesive; S2, uniformly applying the ultraviolet curing adhesive to the surfaces of a packaging substrate and a chip, wherein the ultraviolet curing adhesive wraps the chip and has good contact with the packaging substrate and the chip; S3, uniformly irradiating the surfaceof the ultraviolet curing adhesive with near-ultraviolet light of a desired wavelength, and removing the near-ultraviolet light after the ultraviolet curing adhesive is completely cured so as to complete the ultraviolet curing packaging process. The process prepares the ultraviolet curing adhesive by using MTQ silicone resin, MTQ silicone resin containing a sulfhydryl group, MTQ silicone resin containing a phenyl group and a photo-initiator, greatly improves the sealing property and the transparent stability of the ultraviolet curing adhesive on the chip packaging. The packaging process of the invention is low in cost, high in efficiency and fast, and has significant economic benefits.

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