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发明公开
CN110462855A 包括固体半导体管芯的电子装置 审中-实审

包括固体半导体管芯的电子装置
摘要：
本发明提供了包括聚合物材料层和部分嵌入层中的固体半导体管芯的电子装置。管芯具有突出远离层的第一主表面的第一端部。通过将管芯的第一端部沉入衬里的主表面中可形成电子装置。将可流动的聚合物材料填充到管芯之间的空间中并硬化其以形成聚合物材料层。通过使衬里从管芯的第一端部离层而暴露管芯的第一端部。在该层上提供导电体以连接管芯的第一端部。
摘要（英）：

Electronic devices including a layer of polymeric material and solid semiconductor dies partially embedded in the layer are provided. The dies have first ends projecting away from the first major surface of the layer. The electronic devices can be formed by sinking the first ends of the dies into a major surface of a liner. A flowable polymeric material is filled into the space between the dies and solidified to form the layer of polymeric material. The first ends of the dies are exposed by delaminating the liner from the first ends of the dies. Electrical conductors are provided on the layerto connect the first ends of the dies.

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