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发明公开
CN110564099A 一种线路板基材3D打印树脂及其制备方法 有权

一种线路板基材3D打印树脂及其制备方法
摘要：
本发明公开了一种线路板基材3D打印树脂及其制备方法，本发明的一种线路板基材3D打印树脂，所述线路板基材3D打印树脂包括按重量百分比的如下组分组成：带双键苯并噁嗪树脂10-80%，环氧树脂0-50%，氧杂环丁烷化合物0-30%，阳离子型光引发剂1-15%，丙烯酸酯低聚物5-30%，自由基光引发剂1-5%，颜料填料0-20%。本发明的线路板基材3D打印树脂耐热性好、机械强度高、接近零收缩。
摘要（英）：

The invention discloses circuit board substrate 3D printing resin and a preparation method thereof. The circuit board substrate 3D printing resin comprises the following components in percentages by weight: 10-80% of benzoxazine resin with double bonds, 0-50% of epoxy resin, 0-30% of an oxetane compound, 1-15% of a cationic photoinitiator, 5-30% of an acrylate oligomer, 1-5% of a free radical photoinitiator and 0-20% of pigment filler. The circuit board substrate 3D printing resin is good in heat resistance, high in mechanical strength and close to zero shrinkage.

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