The invention provides an epoxy resin modification method. The resin has the advantages of excellent adhesion, excellent wear resistance, excellent electrical insulation, excellent chemical stability,excellent high and low temperature resistance, low shrinkage rate, easiness in processing and molding, low cost and the like, is one of matrix resins which are most widely applied to polymer composite materials, and is widely applied to the fields of adhesives, electronic instruments, light industry, machinery, aerospace and aviation, electronic and electrical insulating materials and the like. After being cured, pure EP has a three-dimensional network structure, has a high crosslinking density, and also has the defects of large internal stress, hard and brittle texture, poor cracking resistance, poor impact resistance, poor heat and humidity resistance, low peel strength and the like, so the application of the pure EP in some high-tech fields is limited to a great extent. In recent years, the application fields of structural bonding materials, packaging materials, fiber reinforced materials, laminated boards, integrated circuits and the like require that EP material has good comprehensive properties, such as good toughness, low internal stress, excellent heat resistance, excellent water resistance, excellent chemical resistance and the like, so EP modification becomes a current hotspot and research direction.