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发明公开
CN110660688A 具有在包封材料中的凹部的半导体装置和所属的制造方法 审中-公开

具有在包封材料中的凹部的半导体装置和所属的制造方法
摘要：
本公开的实施例涉及具有在包封材料中的凹部的半导体装置和所属的制造方法，方法包括提供至少一个半导体组件，其中至少一个半导体组件中的每个包括：半导体芯片，其中半导体芯片包括第一主表面和与第一主表面相对置的第二主表面，和布置在半导体芯片的相对置的第二主表面上的牺牲材料。该方法还包括用包封材料包封至少一个半导体组件。该方法还包括去除牺牲材料，其中在至少一个半导体芯片中的每个上形成包封材料中的凹部。该方法还包括将至少一个盖布置在至少一个凹部上，其中通过至少一个凹部和至少一个盖在至少一个半导体芯片的每个上形成封闭空腔。
摘要（英）：

Embodiments of the present disclosure relate to a semiconductor device having a recess in an encapsulation material and an associated production method. The method comprises the steps: providing a least one semiconductor component, wherein each of at least one semiconductor component comprises: a semiconductor chip, and the semiconductor chip comprises a first main surface and a second main surface opposite the first main surface, and a sacrificial layer arranged above the opposite second main surface of the semiconductor chip. The method further comprises the step of encapsulating at least one semiconductor component with an encapsulation material. The method further comprises the step of removing the sacrificial material, wherein above each of at least one semiconductor chip a cutout isformed in the encapsulation material. The method further comprises the step of arranging at least one lid above at least one cutout, wherein a closed cavity is formed by at least one cutout and at least one lid above each of at least one semiconductor chip.

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