The invention relates to a micro-seismic sensor taking and placing device with a strain gauge bonding structure and a using method thereof. The device comprises a wall supporting assembly and a telescopic mechanism; the telescopic mechanism drives two arc-shaped plates to be folded inwards or expanded outwards at the same time. The telescopic mechanism comprises a screw rod and rhombic telescopicparts which are symmetrically fixed on two sides of the screw rod along the central axis of the screw rod; each arc-shaped plate is provided with a strain gauge pasting assembly; one end of the screwrod is connected with a micro-vibration sensor, and the other end of the screw rod is connected with an inner guide rod through a connecting sleeve; the inner guide rod drives the screw rod to rotate,and the inner guide rod is sleeved with an outer guide pipe, wherein one end of the outer guide pipe is provided with a bayonet structure. According to the technical scheme, the micro-seismic sensorcan be placed and recycled, and the economic cost is reduced; meanwhile, the strain gauge can be pasted to the inner wall of a to-be-monitored hole in the placing process of the micro-seismic sensor,and then the strain of the hole wall of the to-be-monitored hole is monitored.