The invention provides a heat dissipation system, which comprises a body, a cooling device and a heat transfer device. The body is used for accommodating a computing device, and the body at least hasa first opening and a second opening opposite to each other, an air flow from the first opening to the second opening being capable of dissipating heat of the computing device; the cooling device is arranged in the second opening and is used for reducing the temperature of the airflow reaching the second opening; and a first part of the heat transfer device is in heat conduction contact with the computing device, and a second part of the heat transfer device is in heat conduction contact with the cooling device so as to cool the computing device.