The invention discloses a hole drilling method of a 5G high-end servo printed circuit board thick-thin core composite product. The hole drilling method comprises the following steps of (1) adopting apunching machine to punch out a plurality of rivet holes used for combination and connection with thick core on a thin core board; (2) transferring the thin core board with the rivet holes to a targetmachine, using the target machine to punch a plurality of holes on the thin core board; (3) moving the thin core plate with the target holes into a secondary element measuring machine, taking the target holes as reference points to establish an XOY coordinate system, measuring the coordinate of each rivet hole, and then making the thick core plate drilling process; and (4) putting the thick coreplate into a drilling machine, and correspondingly drilling rivet holes used for combination and connection to the thin core plate on the thick core plate by using the thick core plate drilling process. The hole drilling method can effectively solve the problem of combination of thick and thin core boards, and the product yield and efficiency are greatly improved.