The invention provides a laser emission assembly which comprises a base, a base body located on the surface of the base and a laser chip located on the front face of the base body, and the base body comprises a back face opposite to the front face. Wherein a first conducting strip, a second conducting strip, a first microstrip line and a second microstrip line are also arranged on the front surface of the base body; one end of the first microstrip line is electrically connected with the first electrode of the laser chip, and the other end is electrically connected with the first conducting strip through the first bonding wire; one end of the second microstrip line is electrically connected with the second electrode of the laser chip, and the other end is electrically connected with the second conducting strip through a second bonding wire; the laser emitting assembly further comprises a backflow signal transmission structure, and the backflow signal transmission structure is arranged on the top face and/or the back face of the base body. The laser emission assembly has good performance when emitting high-speed signals.