The invention relates to an electrochemical polishing method for a surface of a copper material. The electrochemical polishing method comprises the following step of preparing a polishing solution; and switching on a power supply to polish after a to-be-polished copper material is immersed into the polishing solution, wherein the step of preparing the polishing solution comprises the following steps of calculating the dosages of solutes according to the total volume of the to-be-prepared solution, the solutes comprising phosphoric acid, glycerin, thiourea and polyoxyethylene alkanolamide; weighing phosphoric acid and glycerin according to the calculating result and importing the same into a corrosion-resistant container, adding water to the total volume, and stirring and dissolving the mixture to obtain a first intermediate solution; weighing thiourea according to the calculating result and adding the thiourea into the first intermediate solution, and stirring and dissolving the mixture to obtain a second intermediate solution; and weighing polyoxyethylene alkanolamide according to the calculating result and adding the polyoxyethylene alkanolamide into the second intermediate solution, and uniformly stirring the mixture to obtain the polishing solution. According to the electrochemical polishing method, the surface roughness of a copper precision part can be increased from Ra0.4 [mu]m to Ra0.2 [mu], so that the using demand on a vacuum electronic apparatus is met.