A die bonding apparatus includes: a lead frame supply station for accommodating a plurality of lead frames; a frame transferring device for picking up the lead frame and transferring it to an Ag epoxy application table or to a traveling rail; a frame fixing station for fixing the lead frame to the Ag epoxy application table by suction power of a vacuum pump or moving it back and forth through actuation of a motor; an Ag epoxy supply station for ejecting a predetermined amount of Ag epoxy through a nozzle to the top surface of the lead frame; a moving device for moving the lead frame forward on the traveling rail; a preheating station for receiving the lead frame into a magazine and preheating it; a wafer placement station for transferring wafers sequentially supplied from a wafer supply station to a predetermined location through rotation; a die transferring device for picking up a die and transferring it to a work site for die bonding; a die bonding station for precisely bonding the die to a site where a tape is stuck or Ag epoxy is applied in the lead frame according to lead on chip (LOC) or normal feature of the lead frame; and a stocker for accommodating the lead frame into an internal magazine.