There is provided a laser machining apparatus, and a laser machining method using the same, which allows an installation area thereof to be reduced while improving working efficiency. The laser machining apparatus has a body portion having a plurality of laser irradiating sections and work mounting sections, a supplying stocker for supplying workpieces, and a discharging stocker for discharging the workpieces. The apparatus further comprises a supply-side transfer unit having work retaining tables capable of attaching/detaching the workpieces and of the same number with the laser irradiating sections, and moving the work retaining tables in the vertical and horizontal directions, and a discharge-side transfer unit having work retaining tables capable attaching/detaching the workpieces andof the same number with the laser irradiating sections, and moving the work retaining tables in the vertical and horizontal directions. The supply-side unit causes the plurality of supply-side work retaining tables to adsorb the workpieces from the supplying stocker one after another and moves these supply-side work retaining tables to the work mounting sections to place the workpieces thereon. The discharge-side unit causes the discharge-side work retaining tables to adsorb the workpieces which have been machined at the work mounting sections to move and discharge those workpieces to the discharging stocker.