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发明授权
CN1684559B 发光器件、其制造方法以及电子设备 有权

发光器件、其制造方法以及电子设备
摘要：
在将驱动电路和像素部分形成在公共基板上的情况下，实现了使框架部分进一步减小。此外，利用大基板使发光器件具有用于获得大量面板的有利结构，由此可以增加从基板中得到的面板数量，从而提高生产率。按照本发明，在与外围电路部分重叠的位置提供接线电极，并且用各向异性的导电粘合材料使接线电极与FPC连接。此外，利用与基板的边缘和周围接触的密封剂将覆盖材料牢固固定。
摘要（英）：

Further reduction in frame portion is achieved in the case where a driver circuit and a pixel portion are formed on a common substrate. Also, a light emitting device is provided with an advantageous structure for obtaining a large number of panels by use of a large substrate, whereby the number of panels taken out from a substrate can be increased, leading to better productivity. According to theinvention, a terminal electrode is provided in the position overlapping a peripheral circuit portion, and the terminal electrode is connected to an FPC with an anisotropic conductive adhesive material. In addition, a covering material is firmly fixed by using a sealant that is in contact with the edge and periphery of a substrate.

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